Module 05 — Introduction to PICs Design

Overview

What you will study

The Introduction to PICs Design course offers an intensive academic exploration of the lifecycle of Photonic Integrated Circuits (PICs), specifically tailored for international students. The curriculum bridges the gap between theoretical semiconductor physics and practical circuit-level engineering on Silicon Photonics and III-V platforms. Students are introduced to the fundamental principles of integrated optics—including light propagation in planar and strip waveguides—before advancing device-level modeling and circuit-level integration.

A core component of the course is the application of numerical methods and simulation techniques using professional EDA tools, including Ansys Lumerical, Optiwave (FDTD, varFDTD, EME), and Nazca Design. The syllabus covers the essential stages of the design flow, from initial element-level simulations to complex mask layout design and topography. Participants will gain insight into the industrial ecosystem of chip development flow, including the fabless model, the role of Process Design Kits (PDKs), and the integration of micro-optical elements like metalenses. By the end of the course, students will have a clear, structured view of the design and verification process, with a strong awareness of the manufacturing-related constraints and material platforms—such as SOI, SiN, and InP—required for contemporary integrated photonic systems.

Topics Covered

Key topics

Integrated optics and light propagation in waveguides
Silicon Photonics and III-V material platforms
Device-level modelling and simulation methods
EDA tools for PIC design (Lumerical, Optiwave, Nazca)
Mask layout design and manufacturing constraints
Fabless model, PDKs, and the PIC design flow

Faculty

Module lecturers

Marcin Lelit

Research Specialist

Warsaw University of Technology – CEZAMAT

Marcin Lelit is a research specialist at the Warsaw University of Technology (WUT) – CEZAMAT and a PhD candidate specializing in application-specific photonic integrated circuits for the visible, telecom and mid-infrared spectral range. For over a decade, he has developed integrated photonic components and circuits on Silicon (SOI, SiN, Ge-on-Si) and III-V (InP) platforms for telecommunications and sensing applications. His professional milestones include designing the first domestically manufactured AWG demultiplexers and completing research internships at IMEC in Belgium and at TSRI/Synopsys in Taiwan. Marcin combines deep engineering expertise—spanning clean-room fabrication, optical and electrical characterization, and "mask-to-system" design—with a strong business development background.

Introduction to PICs Design

What you will study

Key topics

Module lecturers

Module 05 Schedule

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