ISEPS / Curriculum / Module 01
Module 01 of 06
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Fundamentals of Semiconductor Technologies

10 h Online 5 h Onsite 15 h Total
Overview

Module Overview

Fundamentals of Semiconductor Technologies provides an introduction to how integrated circuits (ICs), i.e., the building blocks of virtually all modern electronic devices, are manufactured. The course explains how continuous miniaturization and advances in semiconductor device technology have enabled highly complex solutions such as Systems-on-Chip (SoCs), where multiple functions and devices, often made using different technologies, are integrated into a single electronic system, including integration with optical or mechanical components (MOEMS).

The lecture highlights the strongly interdisciplinary nature of semiconductor technology, combining knowledge from physics, chemistry, materials engineering, mechanics, optics, and electronics. Students are introduced to the unique and extreme conditions required for IC fabrication at the nanoscale, the key processing steps and manufacturing flow, and the practical questions behind modern chip production, such as fabrication techniques, process complexity, production time, and cost. Overall, the course aims to give listeners a clear, structured overview of the semiconductor manufacturing process and its role in enabling today's electronic and integrated systems.

Topics

What You Will Study

Lecturers

Who Teaches This Module

Robert Mroczyński
Robert Mroczyński
Associate Professor
Warsaw University of Technology
He is a graduate of the Faculty of Electronics and Information Technologies at the Warsaw University of Technology (WUT). Since 2018, he has been an associate professor at the Institute of Microelectronics and Optoelectronics; he served as Head of the Microelectronic and Nanoelectronic Devices Division (2021–2024) and has been the Institute's Director since October 2024. His research focuses on the technology, characterization, and diagnostics of semiconductor materials, structures, and devices, with particular interests in transparent and flexible electronics, integrated photonics, and low-dimensional materials. He has completed research and teaching/management internships at leading institutions in the USA, Germany, France, Belgium, and South Korea.
MN
Mateusz Nieborek
TBC
Warsaw University of Technology
Details to be announced.
Piotr Jeżak
Piotr Jeżak
Head Research Officer
Warsaw University of Technology – CEZAMAT
He is a graduate of the Faculty of Electronics and Information Technology at the Warsaw University of Technology (WUT). In 2025, he began his PhD studies on RRAM structures for applications in secure integrated circuits. Since 2023, he has been associated with the Centre for Advanced Materials and Technologies CEZAMAT, where he serves as the head research officer responsible for the electrical characterization of semiconductor devices. His research focuses on the technology and characterization of semiconductor materials and structures, with a strong interest in MOEMS and memory devices. During his studies, he took part in research internships at leading institutions in Germany, Greece, and Taiwan.
Schedule

Module 01 Schedule

Hour breakdown for this module across online and onsite delivery formats.

Topic / Session
Online
Onsite
Total
Fundamentals of Semiconductor Technologies
10 h
5 h
15 h
Module Total
10 h
5 h
15 h

Ready to apply for ISEPS?

20 places available · Hybrid format · Warsaw University of Technology

Co-funded by the European Union · European Funds for Social Development · Republic of Poland